• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Described herein are thermal management devices suitable for heating and cooling objects. An exemplary thermal management device may include a hollow body, an outer shell, support structures, and inlet and outlet openings for a fluid, a portion of the outer shell being complementary to a surface of an article. Support structures for a thermal management device are also described, applications for the device and methods for producing the device.
    公开号:BE1024846B1
    申请号:E2017/5184
    申请日:2017-03-22
    公开日:2018-07-23
    发明作者:Der Schueren Bart Van；Dries Vandecruys
    申请人:Materialise N.V.；
    IPC主号:
    专利说明:

    (30) Priority data:
    22/03/2016 US 62311576 (73) Holder (s):
    MATERIALIZE N.V. 3001, LEUVEN Belgium (72) Inventor (s):
    VAN DER SCHUEREN Bart
    3001 LEUVEN
    Belgium
    VANDECRUYS Dries 3001 LEUVEN Belgium (54) DEVICE AND METHODS FOR THERMAL MANAGEMENT (57) Here, thermal management devices suitable for heating and cooling objects are described. An exemplary thermal management device may include a hollow body, an outer shell, support structures, and fluid inlet and outlet ports, wherein a portion of the outer shell is complementary to a surface of an object. Support structures for a thermal management device, applications for the device, and methods for producing the device are also described.
    A 3 '' 5 i '' M
    FIG. 1A
    FIG. 1B
    BELGIAN INVENTION PATENT
    FPS Economy, K.M.O., Self-employed & Energy
    Publication number: 1024846 Filing number: BE2017 / 5184
    Intellectual Property Office
    International classification: F28F 7/02 F28D 21/00 Date of issue: 23/07/2018
    The Minister of Economy,
    Having regard to the Paris Convention of 20 March 1883 for the Protection of Industrial Property;
    Having regard to the Law of March 28, 1984 on inventive patents, Article 22, for patent applications filed before September 22, 2014;
    Having regard to Title 1 Invention Patents of Book XI of the Economic Law Code, Article XI.24, for patent applications filed from September 22, 2014;
    Having regard to the Royal Decree of 2 December 1986 on the filing, granting and maintenance of inventive patents, Article 28;
    Having regard to the application for an invention patent received by the Intellectual Property Office on 22/03/2017.
    Whereas for patent applications that fall within the scope of Title 1, Book XI, of the Code of Economic Law (hereinafter WER), in accordance with Article XI.19, § 4, second paragraph, of the WER, the granted patent will be limited. to the patent claims for which the novelty search report was prepared, when the patent application is the subject of a novelty search report indicating a lack of unity of invention as referred to in paragraph 1, and when the applicant does not limit his filing and does not file a divisional application in accordance with the search report.
    Decision:
    Article 1
    MATERIALIZE N.V., Technologielaan 15, 3001 LEUVEN Belgium;
    represented by
    GEVERS PATENTS, Holidaystraat 5, 1831, DIEGEM;
    a Belgian invention patent with a term of 20 years, subject to payment of the annual fees as referred to in Article XI.48, § 1 of the Code of Economic Law, for: FURNISHING
    AND METHODS FOR THERMAL MANAGEMENT.
    INVENTOR (S):
    VAN DER SCHUEREN Bart, Technologielaan 15, 3001, LEUVEN;
    VANDECRUYS Dries, Technologielaan 15, 3001, LEUVEN;
    PRIORITY :
    3/22/2016 US 62311576;
    BREAKDOWN:
    Split from basic application: Filing date of the basic application:
    Article 2. - This patent is granted without prior investigation into the patentability of the invention, without warranty of the merit of the invention, nor of the accuracy of its description and at the risk of the applicant (s).
    Brussels, 23/07/2018,
    With special authorization:
    BE2017 / 5184
    DEVICE AND METHODS FOR THERMAL MANAGEMENT
    FIELD OF THE INVENTION
    This application generally relates to the thermal management of objects, such as cooling or heating objects. An exemplary thermal management device may include a hollow body, an outer shell, support structures, and openings for the inflow and outflow of a fluid, a portion of the outer shell being complementary to a surface of an object. In addition, applications for the device and methods for producing the device are described here.
    BACKGROUND
    The operation of many tools and machines depends to a great extent on the temperature at which the devices operate. Thermal management is the monitoring, control and regulation of the temperature of objects. For example, when too much heat is created by frictional forces between parts in a machine or by an electric current through a conductor in an electrical device, cooling is required. Common cooling devices are cooling fins, thermoelectric cooling devices, and fixed structures comprising cooling channels. Conversely, numerous thermal management devices provide heat, typically via heating elements or other radiation means.
    The efficiency of cooling and heating devices can be improved by using materials that maximize heat transfer and / or by using structures that allow efficient heat flow. In technological areas such as mechanical engineering and casting, molten materials are poured or pressed into molds and then cooled in the mold to take a desired shape. Efficient cooling of the molds shortens the cycle time. Accordingly, dies often contain layers of material, some of which have high thermal conductivity, and channels or conduits through which coolant flows. Similarly, conventional cooling devices have coolant channels, and some channels closely follow the geometry of the
    BE2017 / 5184 device and the corresponding part of the object to be cooled. In addition, structural elements such as fins are used to direct the flow of coolant through water jackets.
    While these designs are suitable for cooling / heating a number of objects, 5 there remains a need in the art for better thermal management devices, which have improved features such as intricate internal and external shapes, thin walls, low heat capacity, and geometry which optimizes fluid flow. Here, a thermal management device is described comprising a hollow body, outer shell, support structures, and openings for the inflow and outflow of a fluid, a portion of the outer shell being complementary to a surface of an object. Also described are support structures, methods of using the thermal management device and methods of producing the thermal management device.
    SUMMARY OF THE INVENTION
    A first aspect of this description relates to an object thermal management device comprising a hollow body with an outer shell; a surface that is complementary in shape to at least one surface of the object; a plurality of support structures in the hollow body, a first end of each support structure connected to a first inner wall of the hollow body and a second end of each support structure connected to a second inner wall of the hollow body; an inlet opening to the hollow body; and an outlet opening from the hollow body.
    In some embodiments, the surface of the device that is complementary in shape to the at least one surface of the article is configured to supply or dissipate heat to the article to manage the thermal conditions of the article. In some embodiments, an outer shell wall has a thickness ranging from 0.2 mm to 20 mm. Accordingly, a cross section of the hollow body is between 0.2 mm and 2 mm.
    BE2017 / 5184
    In some embodiments, the surface of the hollow body, which in shape is complementary to the at least one surface of the article, is configured to make direct contact with the at least one surface of the article.
    The plurality of support structures can be arranged in rows in a repeating pattern. The plurality of support structures can be spaced at least 0.2 mm apart. In some embodiments, each support structure includes a unit cell with individual beams. In certain embodiments, the beams include fins, the fins being angled to affect a flow direction from the inlet opening to the outlet opening. In certain embodiments, the bars are arranged in rows to form a network of channels.
    The device may further comprise a first column structure extending from the hollow body and a second column structure extending from the hollow body, the inlet opening connecting to a first hollow column structure and the outlet opening connecting to a second hollow column structure. In some embodiments, the thermal management device is configured to receive a fluid in the inlet port, the hollow body being configured to transfer the received fluid to the outlet port to accomplish the thermal management of the article. The fluid can be a gas or a liquid.
    In some embodiments, the device is made of plastic, metal and / or ceramic.
    In certain embodiments, the device is manufactured through additive manufacturing. The additive manufacturing process can be laser sintering, laser melting, electron beam melting, laser cladding, binder jetting, photo curing, fused deposition modeling, polyjet, ink jetting.
    A further aspect of this description relates to a support structure and / or a plurality of support structures in a hollow body of an article thermal management device, wherein a first end of each support structure is connected to a first inner wall of the hollow body and a second end of each support structure is connected to a second inner wall of the hollow body; an inlet opening to the hollow body; and an outlet opening from the hollow body.
    BE2017 / 5184
    Another aspect of this description pertains to a method of using an article thermal management device, comprising placing the article adjacent to a hollow body device, the hollow body having an outer shell; a surface that is complementary in shape to at least one part of the object; a plurality of support structures in the hollow body, a first end of each support structure connected to a first inner wall of the hollow body and a second end of each support structure connected to a second inner wall of the hollow body; an inlet opening to the hollow body; and an outlet opening from the hollow body; flowing a fluid to the inlet port, through the hollow body, and out the outlet port, thereby performing the thermal management of the article.
    Yet another aspect of this description relates to a method of producing an object thermal management device, comprising obtaining a digital representation of the object; creating a digital surface map of a surface of the device that is complementary in shape to at least one part of the object; expanding the digital surface map to form a digital representation of a three-dimensional object having a hollow body and an inlet opening to the hollow body and an outlet opening of the hollow body; and building the device using an additive manufacturing process.
    BRIEF DESCRIPTION OF THE DRAWINGS
    Figure 1 shows an example of an object thermal management device. The curved surface is complementary to the curved surface of an object.
    Figure 2 shows an interior view of the device, with support structures making contact with the walls of the hollow body. In Figure 2A, parts of the outer shell were removed to show the support structures and the inlet opening. Figure 2B is an enlarged view of a corner of the device, with the inlet opening.
    Figure 3 shows the support structures that fill the hollow body of the device. The outer shell was removed. Figure 3A shows the device in the same orientation as Figures 1 and 2, while Figure 3B shows the reverse view.
    DETAILED DESCRIPTION OF THE INVENTION
    BE2017 / 5184
    One aspect of this description pertains to thermal management devices and methods. Thermal management includes, but is not limited to, monitoring, controlling, and controlling temperature, and may include object heating, object cooling, temperature monitoring, and feedback systems that intermittently measure temperature and then heating and / or cooling mechanisms to maintain the temperature at or around a desired value.
    The efficiency of thermal management devices can be improved by using materials that maximize heat transfer and / or by using structures that allow efficient heat flow. For example, US 8 108 982 (Floodcooling Technologies, LLC) patent describes a die device made from a selection of materials: a non-particulate material forms the body of the formed device, a particulate material forms a surface for a tool and a conduit , and a third material with a high thermal conductivity, such as copper, provides heat transfer between the die device and a tool formed in the die. This mold device also has a design of cooling / heating channels in which liquids flow through segments of liquid channels (conduits) along a path corresponding to the mold surface area. Conventional cooling devices that include channels for transporting heating or cooling fluids are also described in, inter alia, US20140271974 (Honda Motors) and W02015162585 (Sabic Global Technologies), and for cooling devices with complex geometries (US 6656409, Optomec Design Company ). One embodiment of a cooling channel for cooling a mold with a complex geometry is an internal channel that matches and spans the length of a mold, thereby increasing the cooling area. Similarly, combustion engine water jackets are designed to include parts of the engine, and may include structural elements such as internal fins to direct the flow direction of coolant around the engine (e.g. EP2963274, Aisin Seiki).
    While these designs are suitable for cooling / heating specific items, these embodiments have limitations. For example, heating / coolant channels may not cover all areas of the device
    BE2017 / 5184 for thermal management, leading to undesirable or unpredictable temperature gradients along the contact surface. In addition, some thermal management devices can have a relatively high heat capacity if the walls of a thermal management device are thick or the device has a large mass. This internal heat capacity can adversely affect the speed at which the device reaches the desired temperature. Finally, there are only limited descriptions of internal structures designed to modulate the flow of heating or cooling fluid. Accordingly, there remains a need in the art for improved thermal management devices with intricate internal and external shapes, thin walls, low heat capacity, and a geometry that optimizes fluid flow.
    One aspect of this description pertains to thermal management devices and methods. Here, a thermal management device is described having a hollow body, outer shell, support structures, and fluid inlet and outlet ports, wherein a portion of the outer shell is complementary to a surface of an object. Also described are support structures, methods of using the thermal management device and methods of producing the thermal management device.
    Thermal management device
    One aspect of this description relates to a device (also called a thermal management device) for the thermal management of an article, comprising a hollow body with an outer shell; a surface that is complementary in shape to at least one surface of the object; a plurality of support structures in the hollow body, a first end of each support structure connected to a first inner wall of the hollow body and a second end of each support structure connected to a second inner wall of the hollow body; an inlet opening to the hollow body; and an outlet opening from the hollow body.
    The shape of the thermal management device may correspond to one or more parts of the object, such as at least one surface of the object. A surface of the hollow body is complementary in shape to at least one surface of the object, and is configured to make direct contact with the at least one surface of the object.
    BE2017 / 5184 object. The thermal management device may completely enclose the article or may contact selected points of the article or at least one surface of the article. In some embodiments, the surface of the thermal management device which is in shape complementary to the at least one surface of the article is configured to transfer or dissipate heat from the article to manage the thermal conditions of the article. If articles have complicated or unusual geometries, the thermal management devices may have complementary and similarly complicated or unusual geometries.
    In some embodiments, the thermal management device may be in the form of a housing around the article or around a portion of the article. The thermal management device can be thin, for example, with a thickness of 20 mm or less. Accordingly, a cross-section made in the thermal management device can have a thickness ranging from 0.2 mm to 20 mm. In particular, decreasing the thickness of the thermal management devices can decrease the heat capacity of the device itself. An exemplary device with a small heat capacity heats up and cools down faster than a thicker embodiment. This in turn can produce a highly dynamic thermal system in which the object can be heated or cooled more quickly.
    The thermal management device includes a hollow body with an outer shell. As described above, the thermal management device can be thin. The outer shell walls can be thin, for example, with a thickness of 0.2 mm or less. The outer shell walls can be designed to optimize heat transfer.
    Support structures are arranged in rows in the hollow body. A plurality of the support structures can provide support to the outer shell walls. A first end of each support structure is connected to a first inner wall of the hollow body and a second end of each support structure is connected to a second inner wall of the hollow body.
    One aspect of this description relates to the multitude of support structures of a thermal management device. A support structure for a hollow body of a device
    BE2017 / 5184 for thermal management of an article may comprise a plurality of support structures in the hollow body, wherein a first end of each support structure is connected to a first inner wall of the hollow body and a second end of each support structure is connected to a second inner wall of the hollow body. Inner walls can also be considered as the top and bottom surfaces of the hollow body.
    A support structure can comprise one or more beams. The beams may be at an angle of 90 ° to one (or both) of the interior walls of the hollow body. The cross sections of the beams can have a shape such as a circle, an ellipse, a square, a triangle, a rectangle, and / or a polyhedron. The beams may be thicker at one end than the other end, or may have a variable thickness along the length of the beams. All beams in the plurality of support structures may be identical such that all beams have the same length, cross-sectional shape and thickness and are at the same angle in the same direction relative to the inner wall of the hollow body. In some embodiments, the beams in a single support structure and / or the beams in the plurality of support structures are not identical, but vary relative to each other in length, cross-sectional shape, thickness and / or angle to the inner wall with which they contact. Support structures can form a network of channels in the hollow body. Support structures can be at a distance of at least 0.2 mm from each other. In some embodiments, two or more support structures may be spaced at a distance of 0 mm from each other, for example if they are joined at one end such that they contact the same point on the inner wall of the hollow body.
    The support structures may be straight, or they may be curved, or they may be kinked, or they may be bent at an angle at any length along the length of the support structure. Support structures can be fins, or they can be flat planar structures. The support structures can form flat walls in the hollow body and / or can create channels through which a fluid flows. In some embodiments, support structures may be built in a geometry consisting of a combination of at least 1 surface.
    In some embodiments, the plurality of support structures are arranged in rows in a repeating pattern. For example, a support structure can have a multitude of beams
    BE2017 / 5184 extend from a node, and this configuration of beams can be repeated in any support structure throughout the hollow body. In some embodiments, individual bars are arranged to form a unit cell. A support structure may comprise a unit cell (consisting of individual bars), or may comprise more than one unit cell, or may comprise part of a unit cell. If a hollow body has a specific volume and the plurality of support structures are arranged in rows in a repeating pattern, the volume in the hollow body may not accommodate an integer number of unit cells. Thus, some unit cells may be divided into 2, or into 4, or otherwise divided. In some embodiments, unit cells of different sizes can be used to fill the volume in the hollow body.
    In some embodiments, the support structures are arranged in rows in a pattern that forms a dense series of contact points with a first inner wall (for example, the top surface of the hollow body), and a less dense series of contact points with a second inner wall (for example, the bottom surface of the hollow body). Such a pattern need not be a repeating pattern, but may be part of an underlying unit cell design.
    Support structures may include shapes and / or configurations that affect the flow direction of a fluid in the hollow body, for example, the flow from the inlet port to the outlet port. In particular, fluid can flow around support structures and through cavities created by support structures, guided around a maximum volume in the hollow body. Fluid can even be directed to corners, edges and / or other areas of the thermal management device that are difficult to access.
    Directing or directing the flow of the fluid into the hollow body can prevent thermal gradients from occurring when fluid does not reach all areas of the thermal management device evenly. For example, in some thermal management systems that use pipes or channels to transport heating or cooling fluid through the thermal management device, there may be corners of the device farther from the channels than other areas. These remote areas must rely on heat conduction through the walls of the device, creating unwanted thermal gradients.
    BE2017 / 5184
    In some embodiments, the thermal management device includes an inlet opening, an outlet opening, a first column structure extending from the hollow body and a second column structure extending from the hollow body, the inlet opening connecting to a first hollow column structure and connecting the outlet opening on a second hollow column structure. The device may be configured to receive a fluid in the inlet port, the hollow body may be configured to transfer the received fluid to the outlet port to effect the thermal management of the article.
    Fluids for the thermal management device as described herein include, but are not limited to, liquids, gases, and plasma. In some embodiments, the fluid is a liquid. The liquid can be, for example, a heat transfer medium. The heat transfer medium is compatible with the material or materials from which the thermal management device is made. In addition, the heat transfer medium has high thermal conductivity and specific heat, low viscosity, low freezing point, high flash point, low corrosivity, low toxicity, and is thermally stable. In some embodiments, the heat transfer medium is water. Other suitable heat transfer media include but are not limited to deionized water, glycol and water solutions, oils, and dielectric fluids.
    The thermal management device can be made of plastic, metal and / or ceramic.
    In some embodiments, the thermal management device is manufactured through additive manufacturing. Additive manufacturing (AP) - also known as 3D printing, rapid prototyping, rapid manufacturing, [solid] freeform fabrication, layered manufacturing, rapid production, and others - refers to processes in which successive layers of material are formed to build an object, controlled by a computer. These objects can have almost any shape or geometry and are produced in layers starting from a 3D model or other electronic data. One major advantage of AP processes over traditional production methods such as milling or injection molding is the design freedom that is not hindered by limitations of milling machines or molding techniques.
    BE2017 / 5184
    Using AP, it is possible to produce thermal management devices with complex geometric shapes.
    In some embodiments, the AP process is a laser sintering process or a laser melting process. The AP process can be one or more of the following: electron beam melting, laser cladding, binder jetting, photo curing, fused deposition modeling, polyjet, and ink jetting.
    Examples of AP processes include but are not limited to methods that heat, soften, and / or melt materials to produce each layer of the device (e.g., selective laser melting (SLM) or direct metal laser sintering (DMLS), selective laser sintering (SLS), fused deposition modeling (FDM) or fused filament fabrication (FFF), methods in which liquid materials are cured by an energy source such as UV light (eg stereolithography (SLA)), and methods such as laminated object manufacturing (LOM), in which thin layers are cut into shapes from materials such as paper, polymers or metals, and are joined together. engineering net shape (LENS) production (as described in US6459951B1), Scanning Laser Epitaxy (SLE) (a layer-by-layer additive manufacturing process that allows three-dimensional produce ionic objects with a specified microstructure via the controlled melting and solidification of metal powders placed on a base substrate, as described in W02014074947A9), selected area laser deposition (SALD) (a technique for selectively depositing a material layer from a gas phase to produce a part composed of a plurality of deposited layers, as described in US6180049B1), and others.
    In some embodiments, casting processes such as sand casting can also be used to produce the thermal management device. Casting processes use AP as the basis for the casting process.
    Methods for use
    Another aspect of this description pertains to using the thermal management device comprising placing the object adjacent to a hollow body device, the hollow body having an outer shell; a surface that is complementary in shape to at least one surface of the
    BE2017 / 5184 object; a plurality of support structures in the hollow body, a first end of each support structure connected to a first inner wall of the hollow body and a second end of each support structure connected to a second inner wall of the hollow body; an inlet opening to the hollow body; and an outlet opening from the hollow body;
    flowing a fluid to the inlet port, through the hollow body, and out the outlet port, thereby performing the thermal management of the article.
    The thermal management device can be used in any situation where thermal management is required (heating, cooling, or both). For example, the thermal management device can be used as a heat exchanger to quickly heat or cool an object.
    The thermal management unit can be an active heat exchanger, which uses energy to heat or cool the object. The thermal management unit can be a passive heat exchanger that dissipates heat via convection. Support structures may be designed to provide a constant flow of air through the hollow body. In some embodiments, the thermal management unit is a combination of an active and a passive heat exchanger.
    The thermal management device may be an alternative to rectilinear ducts and / or also ducts conforming (curved and accurately following the geometry of the part to be heated or cooled. Accordingly, the thermal management device may be used in conjunction with, or instead of traditional rectilinear or conformal tool die cooling systems.
    In some embodiments, the object to be heated or cooled is a chemical reactor. The thermal management device can provide for rapid cooling or heating of the chemical reactor, for example when a chemical reaction releases heat and needs to be cooled, or when the chemical reaction requires heat or would run faster at higher temperatures.
    The thermal management device can be a cooling fin. In some embodiments, the object to be cooled is an electronic device such as a computer or a computer processor, a silicon semiconductor, portable computers, and parts
    BE2017 / 5184 thereof. Other items that require cooling include, but are not limited to, household appliances, lighting, tools, and engines.
    The thermal management device can be a heating unit. In some embodiments, the thermal management device heats a heat-activated compound, such as a heat-activated glue or adhesive. For example, the thermal management device may be designed to conform in shape to an object to which a coating or coating is to be accurately applied. A heat activated adhesive is applied to one side of the coating, and the coating is contacted with the article, with the adhesive between the coating and the article. Alternatively, the heat-activated adhesive can be applied to the surface of the article, and then the coating is placed over the article. Then, the thermal management device is placed over the article and the coating, and heated to activate the adhesive, so that the adhesive bonds the coating to the article. The thermal management device can be held in place until the adhesive cures, then removed. In some embodiments, the thermal management device can be used as a cooling device to cure the adhesive.
    An example of an object to which a heat-activated adhesive and a coating can be applied is the surface of a car dashboard. A car dashboard has a variety of shapes - curves, depth lines, cutouts, and flat areas. It may be desirable to install a cover, such as a fabric, velvet, leather or plastic, on the surface of the dashboard, but the shape of the dashboard presents unique challenges. In some embodiments, a thermal management device exactly matches the surface of the dashboard. A heat activated adhesive is applied to one side of the upholstery (e.g. a leather upholstery), and the upholstery is brought into contact with the dashboard. The thermal management device is placed over the coating, heated to activate the adhesive, and held in place until the adhesive hardens, then removed. In some embodiments, the thermal management device can be cooled to cure the adhesive.
    Method for producing a thermal management device
    BE2017 / 5184
    Another aspect of this description pertains to a method of producing an object thermal management device, comprising obtaining a digital representation of the object; creating a digital surface map of a surface of the device that is complementary in shape to at least one surface of the object; expanding the digital surface map to digitally represent a three-dimensional object with a hollow body and an inlet opening to the hollow body and an outlet opening of the hollow body; and building the device using an additive manufacturing process.
    In some embodiments, the digital representation of the object is a representation of the entire object. The digital display can be a scan of the object. The digital display can be a display or a scan of a part of the object, for example at least the surface of the object that will contact the thermal management device. In particular, there may be more than one surface of the object that contacts the thermal management device, especially for geometrically shaped or complicated geometry objects. The surface of the thermal management device and the at least one surface of the object are complementary and conforming to each other. A digital surface map is made for the contact surface, i.e., the surface of the thermal management device that will contact the surface of the object.
    The digital surface map is expanded to a digital presentation of the entire thermal management facility. For example, the thermal management device can be substantially the same size as the contact surface. Alternatively, the thermal management device may be larger than the contact area, for example, if the thermal management device has more surfaces or parts except the contact area.
    The digital representation of the thermal management device can be further modified using CAD (computer aided design). The digital representation can be converted into a standard Stereolithography file format. The STL file is electronically cut to form a series of layers representing cross-sections, which will be built by an AP device.
    AP processes and techniques vary depending on the tools used to join the layers of a part, and depending on materials that can
    BE2017 / 5184 are used in the processes. Most processes start with a base material in the form of a liquid, a solid plate or a powder and locally combine the added material. Examples of AP processes include but are not limited to methods that heat, soften, and / or melt materials to produce each layer of the device (e.g., selective laser melting (SLM) or direct metal laser sintering (DMLS), selective laser sintering (SLS), fused deposition modeling (FDM) or fused filament fabrication (FFF), methods in which liquid materials are cured by an energy source such as UV light (eg stereolithography (SLA)), and methods such as laminated object manufacturing (LOM), in which materials such as paper, polymers or metal thin layers are cut into a shape and joined together.Other methods are digital light processing (DLP), laser cladding, multi-phase jet solidification, ballistic particle manufacturing, cold spray additive production, laser engineering net shape (LENS) production (as described in US6459951B1), Scanning Laser Epitaxy (SLE) (a layer-by-layer additive manufacturing process that allows three-dimensional produce sional objects with a specified microstructure through the controlled melting and solidification of metal powders placed on a base substrate, as described in W02014074947A9), selected area laser deposition (SALD) (a technique for selectively depositing a material layer from a gas phase to produce a part composed of a plurality of deposited layers, as described in US6180049B1), and others.
    In some embodiments, the AP process used to produce the thermal management device is a laser sintering process or a laser melting process. The AP process can be one or more of the following: electron beam melting, laser cladding, binder jetting, photo curing, fused deposition modeling, polyjet, and ink jetting.
    BE2017 / 5184
    权利要求:
    Claims (17)
    [1]
    CONCLUSIONS
    An object thermal management device, comprising:
    a hollow body with an outer shell;
    a surface that is complementary in shape to at least one surface of the object;
    a plurality of support structures in the hollow body, a first end of each support structure connected to a first inner wall of the hollow body and a second end of each support structure connected to a second inner wall of the hollow body;
    an inlet opening to the hollow body; and an outlet opening from the hollow body;
    [2]
    The device of claim 1, wherein the surface which is shape-complementary to the at least one surface of the article is configured to supply or dissipate heat to the article to manage the thermal conditions of the article.
    [3]
    The device of claim 1 or claim 2, wherein a wall of the outer shell has a thickness in the range from 0.2mm to 20mm.
    [4]
    The device according to any one of claims 1 to 3, wherein a cross section of the hollow body is between 0.2 mm and 2 mm.
    [5]
    The device of any one of claims 1 to 4, wherein the surface of the hollow body that is complementary in shape to the at least one surface of the article is configured to make direct contact with the at least one surface of the article.
    [6]
    The device of any one of claims 1 to 5, wherein the plurality of support structures are arranged in rows in a repeating pattern.
    [7]
    The device of any one of claims 1 to 6, wherein the plurality of support structures are spaced at least 0.2 mm apart.
    BE2017 / 5184
    [8]
    The device of any one of claims 1 to 7, wherein each support structure comprises a unit cell with individual beams.
    [9]
    The device of claim 8, wherein the beams comprise fins, and wherein the fins are angled to affect a flow direction from the inlet opening to the outlet opening.
    [10]
    The device of claim 8 or claim 9, wherein the beams are arranged in rows to form a network of channels.
    [11]
    The device of any one of claims 1 to 10, further comprising a first column structure extending from the hollow body and a second column structure extending from the hollow body, the inlet opening connecting to a first hollow column structure and the outlet opening connecting to a second hollow column structure.
    [12]
    The device of any one of claims 1 to 11, wherein the device is configured to receive a fluid in the inlet port, and wherein the hollow body is configured to transfer the received fluid to the outlet port for thermal management of the object to establish.
    [13]
    The device of claim 12, wherein the fluid is a gas.
    [14]
    The device of claim 12, wherein the fluid is a liquid.
    [15]
    The device according to any one of claims 1 to 14, wherein the device is made of plastic, metal and / or ceramic.
    [16]
    The device of any one of claims 1 to 15, wherein the device is manufactured through an additive manufacturing process.
    [17]
    The device of claim 16, wherein the additive manufacturing process is laser sintering, laser melting, electron beam melting, laser cladding, binder jetting, photo curing, fused deposition modeling, polyjet, ink jetting.
    BE2017 / 5184
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    同族专利:
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    BE1024846A1|2018-07-17|
    引用文献:
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    DE102013201233A1|2013-01-25|2014-07-31|Siemens Aktiengesellschaft|Heat exchanger for utilizing waste heat of e.g. hot fluid for use with thermoelectric generator, has fluid chambers engaging with walls in cut portion such that flow of fluid is consecutively meandered through chambers|
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    US20160059437A1|2014-08-29|2016-03-03|General Electric Company|Article and process for producing an article|
    法律状态:
    2018-10-03| FG| Patent granted|Effective date: 20180723 |
    2021-12-16| MM| Lapsed because of non-payment of the annual fee|Effective date: 20210331 |
    优先权:
    申请号 | 申请日 | 专利标题
    US201662311576P| true| 2016-03-22|2016-03-22|
    US62311576|2016-03-22|
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